
Global Panel Level Packaging Market to Reach USD 4.0 Billion by 2035, Driven by Demand from 5G, EVs, and IoT | FMI
Japan's panel-level packaging market, valued at USD 220 million in 2024, is growing with strong demand in AI chips, electronics, and support from top firms. NEWARK, DE, UNITED STATES, May 26, 2025 /EINPresswire.com/ -- The global panel level …